Title:
RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED METAL FOIL, RESIN-EQUIPPED FILM, METAL-CLAD LAMINATED SHEET, WIRING SUBSTRATE, AND METHOD FOR PRODUCING MODIFIED POLY(PHENYLENE ETHER)
Document Type and Number:
WIPO Patent Application WO/2022/009977
Kind Code:
A1
Abstract:
The present invention provides: a resin composition able to give a cured product having a reduced dielectric loss tangent and a sufficiently reduced dielectric loss while maintaining a low relative dielectric constant in a high frequency band; a prepreg, a resin-equipped metal foil, a resin-equipped film, a metal-clad laminated sheet and a wiring substrate obtained using the resin composition; and a method for producing a modified poly(phenylene ether) contained in the resin composition. The resin composition contains a modified poly(phenylene ether) having a substituent group A1 represented by formula (A1) at a molecular terminal. At least a part of the substituent group A1 is a substituent group A2 represented by formula (A2). The ratio of the number of moles of the substituent group A2 in the modified poly(phenylene ether) relative to the number of moles of the substituent group A1 in the modified poly(phenylene ether) is more than 20 mol%.
Inventors:
HASHIMOTO KAZUMI (JP)
KAMITANI RYOSUKE (JP)
OTOZAWA NOBUYUKI (JP)
OTA YU (JP)
USUDA TSUKASA (JP)
KASHIWAGI KIMIAKI (JP)
JOMUTA DAISUKE (JP)
KAMITANI RYOSUKE (JP)
OTOZAWA NOBUYUKI (JP)
OTA YU (JP)
USUDA TSUKASA (JP)
KASHIWAGI KIMIAKI (JP)
JOMUTA DAISUKE (JP)
Application Number:
PCT/JP2021/025930
Publication Date:
January 13, 2022
Filing Date:
July 09, 2021
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C08F299/02; C08G65/48; C08J5/24
Domestic Patent References:
| WO2020059562A1 | 2020-03-26 |
Foreign References:
| JP2006516297A | 2006-06-29 | |||
| JP2019157015A | 2019-09-19 |
Attorney, Agent or Firm:
T.S. PARTNERS et al. (JP)
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