Title:
RESIN COMPOSITION, PREPREG, FILM PROVIDED WITH RESIN, METAL FOIL PROVIDED WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/054303
Kind Code:
A1
Abstract:
One aspect of the present invention is a resin composition containing: a polyphenylene ether compound having a carbon-carbon unsaturated double bond at an end thereof; a maleimide compound (A) having an indane structure in a molecule thereof; and an inorganic filler.
Inventors:
UMEHARA HIROAKI
SAITO HIROSUKE
SAITO HIROSUKE
Application Number:
PCT/JP2021/000507
Publication Date:
March 17, 2022
Filing Date:
January 08, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B32B27/00; B32B15/08; B32B27/30; C08F290/06; C08J5/24; H05K1/03
Domestic Patent References:
| WO1993012933A1 | 1993-07-08 | |||
| WO2005073264A1 | 2005-08-11 | |||
| WO2018159080A1 | 2018-09-07 | |||
| WO2019021862A1 | 2019-01-31 | |||
| WO2019230943A1 | 2019-12-05 | |||
| WO2020217678A1 | 2020-10-29 | |||
| WO2020217679A1 | 2020-10-29 |
Foreign References:
| JP2009040934A | 2009-02-26 | |||
| JPS63275562A | 1988-11-14 | |||
| JP2016514742A | 2016-05-23 | |||
| JP2018012671A | 2018-01-25 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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