Title:
RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/243676
Kind Code:
A1
Abstract:
A resin composition comprising (A) a resin comprising a structure derived from a maleimide resin (a) having one or more N-substituted maleimide groups and a structure derived from an amine compound (b) having one or more amino groups and (B) a maleimide resin having three or more N-substituted maleimide groups; and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package which are obtained using the resin composition.
Inventors:
SATO TSUTOMU (JP)
SAKAMOTO NORIHIKO (JP)
OTSUKA KOHEI (JP)
KITAJIMA TAKAYO (JP)
SHIMAOKA SHINJI (JP)
SAKAMOTO NORIHIKO (JP)
OTSUKA KOHEI (JP)
KITAJIMA TAKAYO (JP)
SHIMAOKA SHINJI (JP)
Application Number:
PCT/JP2023/022177
Publication Date:
December 21, 2023
Filing Date:
June 15, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08G73/12; B32B27/34; B32B27/38; C08J5/24; C08L63/00; C08L79/00; H05K1/03
Domestic Patent References:
| WO2017006888A1 | 2017-01-12 | |||
| WO2021132495A1 | 2021-07-01 |
Foreign References:
| JPH04142327A | 1992-05-15 | |||
| JPH06122765A | 1994-05-06 | |||
| JP2022079408A | 2022-05-26 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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