RESIN COMPOSITION, PREPREG, AND LAMINATE - MITSUBISHI GAS CHEMICAL CO

Title:

RESIN COMPOSITION, PREPREG, AND LAMINATE

Document Type and Number:

WIPO Patent Application WO/2012/029690

Kind Code:

A1

Abstract:

[Problem] To provide a resin composition for print circuit boards with a low coefficient for thermal expansion in the surface direction, superior heat resistance and drillability, and capable of maintaining a high degree of incombustibility; to provide a prepreg produced by using the resin composition thereof; and to provide a laminate and metal clad laminate using the aforementioned prepreg. [Solution] This resin composition comprises: an inorganic filler (A) which is a mixture of hydromagnesite and huntite, and expressed by the formula (1) [Formula 1] xMgCO3∙yMg(OH)2∙zH2O (1)(In this formula, x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4); an epoxy resin (B); and a curing agent (C).

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Inventors:

KATO YOSHIHIRO (JP)
OGASHIWA TAKAAKI (JP)
TAKAHASHI HIROSHI (JP)
MIYAHIRA TETSURO (JP)

Application Number:

PCT/JP2011/069393

Publication Date:

March 08, 2012

Filing Date:

August 29, 2011

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)
KATO YOSHIHIRO (JP)
OGASHIWA TAKAAKI (JP)
TAKAHASHI HIROSHI (JP)
MIYAHIRA TETSURO (JP)

International Classes:

C08L63/00; B32B15/08; C08G59/40; C08J5/24; C08K3/26; H05K1/03

Foreign References:

JPH03190965A	1991-08-20
JP2009035728A	2009-02-19
JP2002531672A	2002-09-24
JPH05170984A	1993-07-09
JP2004059643A	2004-02-26
JPH05170984A	1993-07-09
JP2009035728A	2009-02-19

Other References: