Title:
RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, WIRING BOARD, METAL FOIL WITH RESIN, AND FILM WITH RESIN
Document Type and Number:
WIPO Patent Application WO/2024/101362
Kind Code:
A1
Abstract:
The present disclosure addresses the problem of providing: a resin composition which has enhanced moldability and enables the achievement of a cured product that has higher adhesion to a metal; a prepreg which is produced from this resin composition; a metal-clad laminate; a wiring board; a metal foil with a resin; and a film with a resin. This resin composition contains (A) a polyphenylene ether compound, (B) a maleimide compound, (C) a curing agent, and (D) an inorganic filler. The inorganic filler (D) contains (D1) an inorganic filler which is surface-treated with a hydrophobic silane coupling agent, and (D2) an inorganic filler which is surface-treated with a hydrophilic silane coupling agent. The curing agent (C) contains (C1) a phenolic compound which has at least one of a group represented by formula (1) and a group represented by formula (2). The content of the inorganic filler (D1) is 20% by mass to 80% by mass relative to the total amount of the inorganic filler (D1) and the inorganic filler (D2).
Inventors:
YAMADA YUJI
NAKASHIBA TORU
NAKASHIBA TORU
Application Number:
PCT/JP2023/040084
Publication Date:
May 16, 2024
Filing Date:
November 07, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L71/12; B32B15/08; B32B27/00; C08F2/44; C08F290/06; C08J5/24; C08K5/13; C08K5/3415; C08K9/06; H05K1/03
Domestic Patent References:
| WO2020262089A1 | 2020-12-30 | |||
| WO2019131306A1 | 2019-07-04 | |||
| WO2023074429A1 | 2023-05-04 |
Foreign References:
| JP2021123682A | 2021-08-30 | |||
| JP2021138802A | 2021-09-16 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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