Title:
RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE BOARD, RESIN COMPOSITE SHEET, AND, PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/230661
Kind Code:
A1
Abstract:
Provided are a resin composition having an excellent outward appearance when processed and low permittivity, as well as a prepreg, a metal foil-clad laminate board, a resin composite sheet, and a printed circuit board using the resin composition. The resin composition comprises a thermosetting resin (A) and a filler (B), and the filler (B) comprises hollow particles (b) having an average particle diameter of 0.01-10 μm and fulfilling the following formula (i). Formula (i): 1≤D≤10. In the formula (i), D represents the number of bubbles included in the hollow particles (b).
Inventors:
SHIGAKI MASAHIKO (JP)
TAKANO KENTARO (JP)
TAKANO KENTARO (JP)
Application Number:
PCT/JP2019/020935
Publication Date:
December 05, 2019
Filing Date:
May 27, 2019
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L101/00; B32B15/08; B32B27/12; C08J5/24; C08K3/22; C08K3/36; C08K3/38; C08K7/22; C08L71/12; H05K1/03
Domestic Patent References:
| WO2008081885A1 | 2008-07-10 |
Foreign References:
| JP2010260755A | 2010-11-18 | |||
| JP2007048615A | 2007-02-22 | |||
| JP2008174610A | 2008-07-31 | |||
| JP2011037246A | 2011-02-24 | |||
| JPH11145572A | 1999-05-28 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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