Title:
RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATED PLATE, METAL FOIL CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/235329
Kind Code:
A1
Abstract:
This resin composition contains an epoxy compound (A), a curing agent (B), black particles (C), and an inorganic filler (D), wherein the content of the black particles (C) is 1-25 parts by mass with respect to the total content 100 parts by mass of the epoxy compound (A) and the curing agent (B), and the content of the inorganic filler (D) is 100-200 parts by mass with respect to the total content 100 parts by mass of the epoxy compound (A) and the curing agent (B).
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Inventors:
KAMATA YUJI (JP)
NOMOTO AKIHIRO (JP)
HASEBE KEIICHI (JP)
NOMOTO AKIHIRO (JP)
HASEBE KEIICHI (JP)
Application Number:
PCT/JP2020/018367
Publication Date:
November 26, 2020
Filing Date:
May 01, 2020
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08K5/3415; B32B15/092; C08J5/24; C08K3/00; C08K7/16; C08L61/06; C08L63/00; H05K1/03; H05K3/46
Foreign References:
| JP2019006981A | 2019-01-17 | |||
| JP2005281625A | 2005-10-13 | |||
| JP2014037485A | 2014-02-27 | |||
| JP2018168262A | 2018-11-01 | |||
| JP2000281753A | 2000-10-10 | |||
| JP2018203796A | 2018-12-27 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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