RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD

WIPO Patent Application WO/2023/074484

A1

The purpose of the present invention is to provide: a resin composition that is suitably used for manufacturing an insulation layer for a printed wiring board and that has a high dielectric constant, a low dielectric loss tangent, a low water absorptivity, excellent heat characteristics, a high glass transition temperature, a high metal foil peel strength, and a low thermal expansion coefficient; and a prepreg, a resin sheet, a laminated plate, a metal foil-clad laminated plate, and a printed wiring board which are all obtained by using the resin composition. The resin composition according to the present invention contains a dielectric powder (A), a cyanic acid ester compound (B), and an epoxy compound (C). The functional group equivalence ratio (cyanato group/epoxy group) between cyanato groups of the cyanic acid ester compound (B) and epoxy groups of the epoxy compound (C) is 0.1-2.0.

JP2004091556

ACTINIC-RADIATION-CURING COMPOSITION, ACTINIC-RADIATION-CURING INK, AND IMAGE FORMATION METHOD AND INKJET RECORDER USING THE SAME

TAKAMURA TATSURO (JP)
KASHIMA NAOKI (JP)
YAMAGUCHI SHOHEI (JP)
ITO SAYAKA (JP)
NAKAZUMI YOSHIHIRO (JP)
YAMAGATA YUJI (JP)
URAHAMA NARIHIRO (JP)
SUNAKAWA KAZUKI (JP)
TOKUNAGA NAOYA (JP)
MIYAHIRA TETSURO (JP)
OGASHIWA TAKAAKI (JP)

PCT/JP2022/038876

May 04, 2023

October 19, 2022

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MITSUBISHI GAS CHEMICAL CO (JP)

C08L63/00; B32B15/092; C08G59/40; C08J5/24; C08K3/01; C08K3/013; C08L79/04; H05K1/03

WO2021192680A1	2021-09-30
WO2017006898A1	2017-01-12

JP2007131842A	2007-05-31
JP2005501415A	2005-01-13
JP2002344099A	2002-11-29
JP2008001880A	2008-01-10

INABA, Yoshiyuki et al. (JP)

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