Title:
RESIN COMPOSITION, PREPREG SHEET FOR PRINTED CIRCUIT, AND METAL-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2019/214001
Kind Code:
A1
Abstract:
Provided are a resin composition, a prepreg sheet for a printed circuit, and a metal-clad laminate. The resin composition comprises: a silicon arylacetylene resin; and a hydroxyl-terminated polyphenylether resin. The metal-clad laminate prepared by using the resin composition can at least have one of the following properties: a low dielectric loss factor, a high heat resistance, a low thermal expansion coefficient, halogen-free and phosphorus-free flame retardance, etc.
Inventors:
MENG YUNDONG (CN)
FANG KEHONG (CN)
PAN ZIZHOU (CN)
FANG KEHONG (CN)
PAN ZIZHOU (CN)
Application Number:
PCT/CN2018/089250
Publication Date:
November 14, 2019
Filing Date:
May 31, 2018
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08G59/62; C08L63/00; C08G77/60
Foreign References:
| CN104356604A | 2015-02-18 | |||
| CN104962085A | 2015-10-07 | |||
| CN103937156A | 2014-07-23 | |||
| JP2001261791A | 2001-09-26 |
Other References:
HUANG, FARONG ET AL.: "High Heat Resistant Silicone Hybrid Aromatic Resin and Composite Material Thereof", SUMMARY OF THE 2015 NATIONAL POLYMER ACADEMIC PAPERS CONFERENCE PAPERS- TOPIC J HIGH PERFORMANCE POLYMERS, 17 October 2015 (2015-10-17)
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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