Title:
RESIN COMPOSITION, PREPREG USING SAME, FILM PROVIDED WITH RESIN, METAL FOIL PROVIDED WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/239845
Kind Code:
A1
Abstract:
As aspect of the present invention relates to a resin composition comprising a compound (A) represented by the formula X-Y (In the formula, X is 9,10-dihydro-9-oxa-10-phosphaphenanthren-10-yl-10-oxide, and Y is a protecting group.) and a thermosetting resin (B) comprising at least one selection from epoxy resins, polyphenylene ether resins, cyanate ester resins, phenolic resins, active ester resins, benzoxazine resins, maleimide resins, acrylic resins, methacrylic resins, vinyl resins, allyl resins, propenyl resins, and hydrocarbon resins having an unsaturated double bond.
Inventors:
SAITO HIROSUKE
WANG YIQUN
INOUE HIROHARU
NISHIGUCHI YASUNORI
WANG YIQUN
INOUE HIROHARU
NISHIGUCHI YASUNORI
Application Number:
PCT/JP2022/020115
Publication Date:
November 17, 2022
Filing Date:
May 12, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L101/00; B32B15/08; C08J5/18; C08J5/24; C08K5/5313; H05K1/03
Domestic Patent References:
| WO2015064064A1 | 2015-05-07 | |||
| WO2013137257A1 | 2013-09-19 |
Foreign References:
| JP5215254B2 | 2013-06-19 | |||
| JP2009263363A | 2009-11-12 | |||
| JP2008214427A | 2008-09-18 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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