Title:
RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2024/101707
Kind Code:
A1
Abstract:
A resin composition according to one embodiment disclosed in the present application comprises: an epoxy resin; a curing agent including a cyanate ester-based resin and a phenol-based resin; inorganic particles including silica particles; and a curing accelerator, wherein the weight ratio of the cyanate ester-based resin to the phenol-based resin is 95:5 to 40:60, and the curing accelerator includes an imidazole-based compound and a metal-based compound.
Inventors:
PARK JUN WUK (KR)
KIM TAE SOON (KR)
YOON YOUNGSIK (KR)
CHOI BYUNG JU (KR)
KIM TAE SOON (KR)
YOON YOUNGSIK (KR)
CHOI BYUNG JU (KR)
Application Number:
PCT/KR2023/016214
Publication Date:
May 16, 2024
Filing Date:
October 19, 2023
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08G59/40; C08G59/62; C08K3/36; C08L63/00; C08L63/04; H05K1/03
Foreign References:
| KR20100095378A | 2010-08-30 | |||
| KR20110054072A | 2011-05-24 | |||
| KR20050024871A | 2005-03-11 | |||
| KR20160088753A | 2016-07-26 | |||
| KR102231099B1 | 2021-03-23 |
Attorney, Agent or Firm:
CHOI, Hee-Kyeong et al. (KR)
Download PDF:
Previous Patent: RACK STRUCTURE FOR SUPPORTING FACILITY PIPING
Next Patent: SYSTEM AND METHOD FOR DIAGNOSING SLEEP APNEA BY USING INFRARED CAMERA
Next Patent: SYSTEM AND METHOD FOR DIAGNOSING SLEEP APNEA BY USING INFRARED CAMERA