Title:
RESIN COMPOSITION FOR PRINTED WIRING BOARD, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/073891
Kind Code:
A1
Abstract:
Provided is a resin composition for a printed wiring board capable of exhibiting excellent dielectric properties (extremely low dissipation factor tangent) appropriate for high-frequency use, and, when used in a copper-clad laminate board or a printed wiring board, can demonstrate excellent adherence between layers, and heat resistance. This composition includes: a maleimide resin; a polyimide resin in the amount of 150-1200 parts by weight per 100 parts by weight of the maleimide resin; and a polycarbodiimide resin in the amount of 15-120 parts by weight per 100 parts by weight of the maleimide resin.
Inventors:
HOSOI TOSHIHIRO (JP)
YONEDA YOSHIHIRO (JP)
MATSUSHIMA TOSHIFUMI (JP)
YONEDA YOSHIHIRO (JP)
MATSUSHIMA TOSHIFUMI (JP)
Application Number:
PCT/JP2018/037165
Publication Date:
April 18, 2019
Filing Date:
October 04, 2018
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C08L35/00; C08K3/36; C08L79/02; C08L79/08; H05K1/03
Domestic Patent References:
| WO2017168732A1 | 2017-10-05 | |||
| WO2012121164A1 | 2012-09-13 |
Foreign References:
| JPH09227851A | 1997-09-02 | |||
| JPH10279799A | 1998-10-20 | |||
| JP2007196471A | 2007-08-09 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Download PDF: