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Patent Searching and Data


Title:
RESIN COMPOSITION, PRODUCTION METHOD OF RESIN COMPOSITION, MOLDING MATERIAL AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/068375
Kind Code:
A1
Abstract:
The present invention provides a resin composition to which proteins do not adhere easily and, therefore, which is suitable for manufacturing an article that comes in contact with proteins, said resin composition containing a vinyl chloride-based polymer (A1), a plasticizer (A2) and a (meth)acrylic copolymer (B), wherein the (meth)acrylic copolymer (B) is a block copolymer or a graft copolymer containing a monomer unit (b1) represented by formula (1). [Chemical formula 1]

Inventors:
FUKUTA HIROKI (JP)
OTANI GO (JP)
NISHIMURA MASANARI (JP)
MIYAWAKI KENJI (JP)
Application Number:
PCT/JP2022/039414
Publication Date:
April 27, 2023
Filing Date:
October 21, 2022
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
MCPP INNOVATION LLC (JP)
International Classes:
C08L27/06; A61L33/06; C08F265/06; C08L51/00; C08L53/00
Domestic Patent References:
WO2014046158A12014-03-27
WO1988004304A11988-06-16
WO1995017435A11995-06-29
Foreign References:
JPS5088176A1975-07-15
JPH04152952A1992-05-26
JPH02209150A1990-08-20
JPH0951941A1997-02-25
JP2021173458A2021-11-01
JP2022151815A2022-10-07
JP2004161954A2004-06-10
JP2013121430A2013-06-20
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JPH06298921A1994-10-25
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JPH09510499A1997-10-21
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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