Title:
RESIN COMPOSITION, PRODUCTION METHOD THEREFOR, ADHESIVE FILM, AND BONDING SHEET FOR INTERLAMINAR BONDING
Document Type and Number:
WIPO Patent Application WO/2022/255078
Kind Code:
A1
Abstract:
Provided is a resin composition for adhesive films which has a low dielectric loss and nevertheless attains a sufficient adhesion strength and which can give adhesive films inhibited from suffering resin flow. The resin composition comprises (A) a styrene/butadiene/butylene/styrene block copolymer, (B) an epoxy resin, and (C) a thermosetting resin which is not an epoxy resin, wherein the (A) component has a styrene content of 31-60%.
Inventors:
KUSAMA MUNETOSHI (JP)
USAMI RYO (JP)
USAMI RYO (JP)
Application Number:
PCT/JP2022/020427
Publication Date:
December 08, 2022
Filing Date:
May 16, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L53/02; C08J3/20; C08K5/14; C08L63/00; C08L71/12; C09J7/35; C09J11/06; C09J109/06; C09J163/00; C09J171/00; C09J201/00
Domestic Patent References:
| WO2019151014A1 | 2019-08-08 |
Foreign References:
| JP2019006879A | 2019-01-17 | |||
| JP2020015859A | 2020-01-30 | |||
| JP2016027131A | 2016-02-18 |
Attorney, Agent or Firm:
WATANABE Kazuhira (JP)
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