Title:
RESIN COMPOSITION FOR SEALANT, LAMINATED FILM, AND PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2013/094472
Kind Code:
A1
Abstract:
The present invention provides: a resin composition for a sealant, which can have improved non-adsorbability onto an organic component contained in a content and improved heat-seal properties; a laminated film; and a packaging bag. The resin composition for a sealant according to the present invention comprises a resin produced by blending a cycloolefin polymer (COP), a cycloolefin copolymer (COC) and polyethylene (PE) together, wherein the content ratio of these components is as follows: 42-98 wt% of the cycloolefin polymer (COP), 1 to 49 wt% of the cycloolefin copolymer (COC), and 1 to 19 wt% of polyethylene (PE).
Inventors:
KASHIMA KOUSUKE (JP)
OKAMOTO HAJIME (JP)
INADA MASAKAZU (JP)
YOSHIDA MIHOKO (JP)
OKAMOTO HAJIME (JP)
INADA MASAKAZU (JP)
YOSHIDA MIHOKO (JP)
Application Number:
PCT/JP2012/082046
Publication Date:
June 27, 2013
Filing Date:
December 11, 2012
Export Citation:
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
C09K3/10; B32B27/00; B65D30/02; B65D65/40; C08L23/04; C08L45/00
Foreign References:
| JP2010077391A | 2010-04-08 | |||
| JP2008517079A | 2008-05-22 | |||
| JP2010031252A | 2010-02-12 | |||
| JP2008207823A | 2008-09-11 | |||
| JPH06271716A | 1994-09-27 | |||
| JP2010077391A | 2010-04-08 | |||
| JPH05271484A | 1993-10-19 |
Other References:
See also references of EP 2796524A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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Claims: