Title:
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/170873
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition whereby voids during application are suppressed, voids and delamination subsequent to reflow after mounting and moisture absorption resistance testing are suppressed, and delamination and resistance value variation after curing are suppressed when the resin composition is used in a prior-supply-type process. The present invention is a resin composition characterized by including (A) an acrylate compound or methacrylate compound having a specific structure and not having an alicyclic structure, (B) an acrylate compound or methacrylate compound having an alicyclic structure and not having a structure represented by chemical formula (1), (C) an acid-anhydride-modified polybutadiene compound, (D) silica particles, and (E) a polymerization initiator.
Inventors:
MYODO HIROKI (JP)
HOTCHI TOYOKAZU (JP)
HOTCHI TOYOKAZU (JP)
Application Number:
PCT/JP2017/013275
Publication Date:
October 05, 2017
Filing Date:
March 30, 2017
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L33/04; C08F2/44; H01L21/60; H01L23/29; H01L23/31
Foreign References:
| JP2015078303A | 2015-04-23 | |||
| JP2015017169A | 2015-01-29 | |||
| JP2015019012A | 2015-01-29 | |||
| JP2015002204A | 2015-01-05 | |||
| JP2014033197A | 2014-02-20 | |||
| JP2004168933A | 2004-06-17 |
Attorney, Agent or Firm:
WATARAI Yusuke (JP)
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