Title:
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/162928
Kind Code:
A1
Abstract:
Provided is a resin composition that can enhance heat dissipating ability of an obtained cured product and that can enhance the flexibility of the obtained cured product. A resin composition according to the present invention contains a thermosetting resin and an insulating filler. The insulating filler has a maximum particle size of 45 μm or less. When a cured product of the resin composition is obtained through application of heat for 2 hours at 150°C, the thermal conductivity of the cured product is 1.0 W/m·K or more, and the storage modulus of the cured product at 25°C is 2000 MPa or less.
Inventors:
FURUKAWA ATSUSHI (JP)
NISHIMURA TAKASHI (JP)
WANG WENTAO (JP)
NISHIMURA TAKASHI (JP)
WANG WENTAO (JP)
Application Number:
PCT/JP2023/006014
Publication Date:
August 31, 2023
Filing Date:
February 20, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; C08G59/20; C08G59/22; C08G59/40; C08K3/013; C08L9/00; C08L63/00; C09J11/04; C09J109/00; C09J163/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2021125248A1 | 2021-06-24 | |||
| WO2021256081A1 | 2021-12-23 |
Foreign References:
| JP2017075324A | 2017-04-20 | |||
| JP2012041421A | 2012-03-01 | |||
| JP2012041422A | 2012-03-01 | |||
| JP2019131668A | 2019-08-08 | |||
| US20120329913A1 | 2012-12-27 | |||
| JP2006515030A | 2006-05-18 | |||
| JP2011016948A | 2011-01-27 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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