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Title:
RESIN COMPOSITION AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2005/090510
Kind Code:
A1
Abstract:
A resin composition useful as the adhesive for bonding semiconductor chips or heat-dissipating members, characterized by comprising at least (A) a filler, (B) a compound which contains a structure represented by the general formula (1) in the backbone skeleton and has at least one functional group represented by the general formula (2), and (C) a thermal radical initiator and by being substantially free from any photopolymerization initiator: The composition is excellent in quick curing properties and applicable to oven curing, and can provide semiconductor devices excellent in reliability of solder crack resistance and so on when used as the die-attach material for semiconductors.

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Inventors:
OKUBO HIKARU (JP)
TANAKA NOBUKI (JP)
WATANABE ITARU (JP)
Application Number:
PCT/JP2005/004700
Publication Date:
September 29, 2005
Filing Date:
March 16, 2005
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
OKUBO HIKARU (JP)
TANAKA NOBUKI (JP)
WATANABE ITARU (JP)
International Classes:
C08F290/06; C08G69/40; C08G69/46; C09J201/02; H01L21/52; H01L21/58; H01L23/373; (IPC1-7): C09J201/02; C08F290/06; H01L21/52
Foreign References:
JPH10505599A1998-06-02
JP2003221443A2003-08-05
JP2003040939A2003-02-13
JP2003277699A2003-10-02
JP2003327925A2003-11-19
JP2004075904A2004-03-11
JP2004018749A2004-01-22
JP2000063452A2000-02-29
JPH1143587A1999-02-16
JPH10505599A1998-06-02
JP2000514496A2000-10-31
JP2001501230A2001-01-30
JPH11106455A1999-04-20
JP2001261939A2001-09-26
JP2002020721A2002-01-23
JP2000273326A2000-10-03
US20020007042A12002-01-17
Other References:
See also references of EP 1736520A4
Attorney, Agent or Firm:
Kishimoto, Tatsuhito c/o Tokyo, Central Patent Firm (4th Floor Oak Building Kyobashi, 16-10, Kyobashi 1-chome, Chuou-k, Tokyo 31, JP)
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