Title:
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND COPPER FOIL-ATTACHED RESIN COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2022/045663
Kind Code:
A1
Abstract:
A resin composition for a semiconductor package according to an embodiment is a composite of a resin and a filler disposed in the resin, wherein the filler comprises at least one depression in the surface thereof, the filler has a content ranging between 10 vol% to 40 vol% in the total volume of the resin composition, and a porosity corresponding to a volume occupied by the depression in the total volume of the filler has a range between 20% to 35%.
Inventors:
CHOI BYEONG KYUN (KR)
HWANG MIN YOUNG (KR)
KIM MOO SEONG (KR)
LEE JIN SEOK (KR)
HWANG MIN YOUNG (KR)
KIM MOO SEONG (KR)
LEE JIN SEOK (KR)
Application Number:
PCT/KR2021/010891
Publication Date:
March 03, 2022
Filing Date:
August 17, 2021
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
C08K7/24; B32B15/08; B32B15/20; C08J5/18; C08J9/28; C08K3/22; C08K3/36; C08L63/00; C08L79/08; H05K1/03
Domestic Patent References:
| WO2019230661A1 | 2019-12-05 | |||
| WO2019203266A1 | 2019-10-24 |
Foreign References:
| JP2007161518A | 2007-06-28 | |||
| JP2005041937A | 2005-02-17 | |||
| US20120301824A1 | 2012-11-29 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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