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Title:
RESIN COMPOSITION FOR SEMICONDUCTOR SEALING, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/286728
Kind Code:
A1
Abstract:
This resin composition for semiconductor sealing includes an epoxy resin (A), a curing agent (B) containing a phenol resin (B1) and an active ester resin (B2), and a curing accelerator (C). The active ester resin (B2) has a structure represented by general formula (1). The curing accelerator (C) contains one or more substances selected from the group consisting of tetraphenylphosphonium-4,4'-sulfonyldiphenolate, tetraphenylphosphonium bis(naphthalene-2,3-dioxy)phenylsilicate, and 4-hydroxy-2-(triphenylphosphonium)phenolate.

Inventors:
UNOKI NORIMITSU (JP)
MATSUNAGA TAKAHIDE (JP)
Application Number:
PCT/JP2022/027223
Publication Date:
January 19, 2023
Filing Date:
July 11, 2022
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08G59/40; C08K3/013; C08K5/544; C08L63/00; C08L83/04; H01L23/29; H01L23/31
Domestic Patent References:
WO2020137989A12020-07-02
WO2020195883A12020-10-01
WO2018008416A12018-01-11
Foreign References:
JP2016117904A2016-06-30
JP2012246367A2012-12-13
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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