Title:
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/264994
Kind Code:
A1
Abstract:
Provided are: a resin composition that, when being used for manufacturing a multilayer printed wiring board, does not inhibit a light curing reaction in an exposure step and that can provide excellent alkali developing ability in a development step; a resin sheet; a multilayer printed wiring board; and a semiconductor device. The resin composition according to the present invention contains a compound (A) represented by formula (1), and a compound (B) that is other than the compound (A) represented by formula (1) and that includes at least one carboxy group. (In formula (1), each R1 independently represents a hydrogen atom or a group represented by formula (2). Each R2 independently represents a hydrogen atom or a linear or branched alkyl group having 1-6 carbon atoms. However, at least one R1 is a group represented by formula (2)). (In formula (2), -* indicates a bond.)
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Inventors:
KUMAZAWA YUNE (JP)
KATAGIRI SHUNSUKE (JP)
SUZUKI TAKUYA (JP)
KATAGIRI SHUNSUKE (JP)
SUZUKI TAKUYA (JP)
Application Number:
PCT/JP2022/023722
Publication Date:
December 22, 2022
Filing Date:
June 14, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F22/40; C08F2/44; C08K5/10; G03F7/004; G03F7/027; G03F7/029; G03F7/031; H05K1/03; H05K3/28; H05K3/46
Domestic Patent References:
| WO2020262579A1 | 2020-12-30 | |||
| WO2021117760A1 | 2021-06-17 | |||
| WO2018056466A1 | 2018-03-29 |
Foreign References:
| JP2014234500A | 2014-12-15 | |||
| JP2017039894A | 2017-02-23 | |||
| JP2015229734A | 2015-12-21 | |||
| JP2015229734A | 2015-12-21 | |||
| JPH0912712A | 1997-01-14 | |||
| JP2021099134A | 2021-07-01 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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