Title:
RESIN COMPOSITION, RESIN SHEET, PREPREG, INSULATING MATERIAL, RESIN-SHEET CURED ARTICLE, AND HEAT-DISSIPATING MEMBER
Document Type and Number:
WIPO Patent Application WO/2016/190323
Kind Code:
A1
Abstract:
A resin composition containing a heat-curable resin, a thermally conductive filler, and mica, wherein the proportion of the thermally conductive filler which a filler group (C) constitutes, by volume, is greater than the proportion of the thermally conductive filler which a filler group (B) constitutes, by volume, given that the thermally conductive filler is divided into a filler group (A) having a particle diameter of 10-100μm, inclusive, the filler group (B), which has a particle diameter of at least 1.0μm and less than 10μm, and the filler group (C), which has a particle diameter of at least 0.1μm and less than 1.0μm.
Inventors:
TAKEZAWA YOSHITAKA (JP)
SONG SHIHUI (JP)
FUKUSHIMA KEIJI (JP)
TANASE TOMOKAZU (JP)
KATOH TETSUJI (JP)
SANO AKIHIRO (JP)
KOJIMA HIROAKI (JP)
SONG SHIHUI (JP)
FUKUSHIMA KEIJI (JP)
TANASE TOMOKAZU (JP)
KATOH TETSUJI (JP)
SANO AKIHIRO (JP)
KOJIMA HIROAKI (JP)
Application Number:
PCT/JP2016/065360
Publication Date:
December 01, 2016
Filing Date:
May 24, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; B32B15/08; C08J5/24; C08K3/22; C08L63/00; C09K5/14; H01B3/40
Domestic Patent References:
| WO2014208694A1 | 2014-12-31 |
Foreign References:
| JP2005171209A | 2005-06-30 | |||
| JPH1192627A | 1999-04-06 | |||
| JPH06207044A | 1994-07-26 | |||
| JPS5679161A | 1981-06-29 |
Other References:
See also references of EP 3305856A4
Attorney, Agent or Firm:
Taiyo, Nakajima & Kato (JP)
Patent business corporation solar international patent firm (JP)
Patent business corporation solar international patent firm (JP)
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