Title:
RESIN COMPOSITION, RESIN SHEET, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/013709
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide: a resin composition that can be used suitably in the production of a resin sheet and prepreg having excellent drillability; and a resin sheet, a prepreg, a metal foil-clad laminate, and a printed wiring board obtained using the resin composition. The resin composition of the present invention includes: a molybdenum compound (A); a thermally curable compound (B) that includes a polysiloxane structure and at least one group selected from the group consisting of a maleimide group, an amino group, an epoxy group, a carboxyl group, a vinyl group, a hydroxy group, and a (meth)acryl group; a thermally curable resin (C) different from the thermally curable compound (B); and an inorganic filler (D) different from the molybdenum compound (A).
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Inventors:
TOMIZAWA KATSUYA (JP)
YAMAGUCHI SHOHEI (JP)
KANEKO NAOYOSHI (JP)
TAKAHASHI HIROSHI (JP)
YAMAGUCHI SHOHEI (JP)
KANEKO NAOYOSHI (JP)
TAKAHASHI HIROSHI (JP)
Application Number:
PCT/JP2022/029869
Publication Date:
February 09, 2023
Filing Date:
August 04, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L101/00; B32B15/08; B32B27/00; C08J5/24; C08K3/013; C08K3/11; C08K3/24; C08L79/00; C08L83/04
Foreign References:
| JP2014129520A | 2014-07-10 | |||
| JP2019009195A | 2019-01-17 | |||
| JP2015086253A | 2015-05-07 | |||
| JP2017178991A | 2017-10-05 | |||
| JP2015224304A | 2015-12-14 | |||
| JP2016030757A | 2016-03-07 | |||
| JP2014111696A | 2014-06-19 | |||
| JP2016060780A | 2016-04-25 | |||
| JP2019099710A | 2019-06-24 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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