RESIN COMPOSITION, RESIN SHEET, PREPREG, AND PRINTED WIRING BOARD

WIPO Patent Application WO/2021/149733

A1

[Problem] To provide: a resin composition with which excellent low permittivity properties, low dielectric dissipation properties, flexibility, and peel strength can be obtained; a resin sheet; a prepreg; and a printed wiring board. [Solution] A resin composition containing: a maleimide compound (A) that exhibits a relative permittivity of less than 2.7; a polyphenylene ether compound (B) that is represented by general formula (1) and has a number-average molecular weight of 1,000 to 7,000; and a block copolymer (C) that has a styrene skeleton. In general formula (1), X represents an aryl group, -(Y-O)n2- represents a polyphenylene ether moiety, R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n2 represents an integer of 1-100, n1 represents an integer from 1 to 6, and n3 represents an integer from 1 to 4.

HIRANO SHUNSUKE (JP)
KATO YOSHIHIRO (JP)
ITO MEGURU (JP)
NOBUKUNI TAKESHI (JP)
SUGIMOTO NORIAKI (JP)
KUBO TAKASHI (JP)
KOGA SHOUTA (JP)
UENO YOSHITAKA (JP)

PCT/JP2021/001889

July 29, 2021

January 20, 2021

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MITSUBISHI GAS CHEMICAL CO (JP)
MGC ELECTROTECHNO CO LTD (JP)

B32B27/28; C08F290/06; C08G61/02; C08G65/48; C08G73/00; C08J5/24; C08L53/02; H05K1/03

WO2019230945A1	2019-12-05
WO2020004211A1	2020-01-02
WO2018159080A1	2018-09-07
WO2020054601A1	2020-03-19
WO2019230945A1	2019-12-05

JP2010111758A	2010-05-20
JP2009161725A	2009-07-23
JPH0525296A	1993-02-02
US20020123542A1	2002-09-05

FUJIKI Hiroshi et al. (JP)

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