Title:
RESIN COMPOSITION AND RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2021/117796
Kind Code:
A1
Abstract:
A resin composition according to the present invention contains (A) a heat curing component and (B) a silane coupling agent. The (A) heat curing component contains a (A1) maleimide resin, and the (B) silane coupling agent is a compound represented by general formula (B1) below. (R210)a (R22)3-aSi-L21-NH-L22-NH-R23 ... (B1) (In general formula (B1), R21 is an alkyl group, R22 and R2３ are each an independent monovalent organic group, L21 and L22 are each an independent bivalent organic group, and a is 1, 2, or 3.)
Inventors:
KARASAWA YASUNORI (JP)
WATANABE YASUTAKA (JP)
WATANABE YASUTAKA (JP)
Application Number:
PCT/JP2020/045975
Publication Date:
June 17, 2021
Filing Date:
December 10, 2020
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08G73/12; C08K5/3492; C08K5/5455; C08K5/548; C08L79/00; C09J7/35; C09J11/04; C09J11/06; C09J135/00; H01L23/29; H01L23/31
Foreign References:
| JP2018154791A | 2018-10-04 | |||
| JP2017110051A | 2017-06-22 | |||
| JP2018115233A | 2018-07-26 | |||
| JPH0693085A | 1994-04-05 | |||
| JPH05230232A | 1993-09-07 | |||
| JP2008095063A | 2008-04-24 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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