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Title:
RESIN COMPOSITION FOR SKIN PACK, FILM FOR SKIN PACK, METHOD FOR PRODUCING FILM FOR SKIN PACK, SKIN PACK PACKAGING MATERIAL, AND SKIN PACK PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/202424
Kind Code:
A1
Abstract:
Provided is a resin composition for a skin pack, which contains an ionomer (A) of an ethylene·unsaturated carboxylic acid-based copolymer. The ionomer (A) of an ethylene·unsaturated carboxylic acid-based copolymer satisfies the relationship 11 ≤ (X×Y×0.01)/Z. This resin composition for a skin pack contains the ionomer (A) of an ethylene·unsaturated carboxylic acid-based copolymer. The melt tension of the ionomer (A) of an ethylene·unsaturated carboxylic acid-based copolymer, as measured using a specific measurement method is 320 mN or more.

Inventors:
MUKAI KENTA (JP)
TANIGUCHI YOSHITERU (JP)
MACHIYA HIROAKI (JP)
Application Number:
PCT/JP2022/011136
Publication Date:
September 29, 2022
Filing Date:
March 11, 2022
Export Citation:
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Assignee:
DOW MITSUI POLYCHEMICALS CO LTD (JP)
International Classes:
C08L23/26; B65D65/40
Domestic Patent References:
WO2019181942A12019-09-26
Foreign References:
JPH0564540A1993-03-19
JP2002200719A2002-07-16
JPH03148460A1991-06-25
JP2011505489A2011-02-24
JP2020093417A2020-06-18
JP2016222259A2016-12-28
JP2021047869A2021-03-25
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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