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Title:
RESIN COMPOSITION FOR SKIN PACKAGING, SKIN PACKAGING FILM, PRODUCTION METHOD FOR SKIN PACKAGING FILM, SKIN PACKAGING MATERIAL AND SKIN PACKAGING
Document Type and Number:
WIPO Patent Application WO/2022/186090
Kind Code:
A1
Abstract:
Provided is a resin composition for skin packaging, comprising an ionomer (A) of an ethylene-unsaturated carboxylic acid copolymer, wherein the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is neutralized with two or more metal ions.

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Inventors:
MUKAI KENTA (JP)
TANIGUCHI YOSHITERU (JP)
MACHIYA HIROAKI (JP)
Application Number:
PCT/JP2022/008058
Publication Date:
September 09, 2022
Filing Date:
February 25, 2022
Export Citation:
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Assignee:
DOW MITSUI POLYCHEMICALS CO LTD (JP)
International Classes:
B65D65/40; C08F8/42; C08L23/26
Domestic Patent References:
WO1989004853A11989-06-01
WO2019181942A12019-09-26
Foreign References:
JPH0753636A1995-02-28
JPH02140253A1990-05-29
JPH02138354A1990-05-28
KR20180115885A2018-10-24
JP2021006471A2021-01-21
JP2015098333A2015-05-28
US5542677A1996-08-06
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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