Title:
RESIN COMPOSITION FOR STEREOLITHOGRAPHY
Document Type and Number:
WIPO Patent Application WO/2022/075312
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition for stereolithography, the resin composition being able to suppress the occurrence of uneven coloration and being able to provide good shapeability. The present invention achieves the foregoing with a resin composition for stereolithography, which is obtained by blending a UV light-curable resin (A) and an inorganic pigment (B), the resin composition for stereolithography being characterized in that the inorganic pigment (B) has a specific gravity of 2.0 ≤ ρ and a particle size distribution of D50 ≤ 5 μm and D90 ≤ 20 μm, and that the viscosity of the resin composition for stereolithography at 25°C is 100 mPa・s or greater.
Inventors:
ARIGA YOUHEI (JP)
NISHIZAWA SHIGETOSHI (JP)
NISHIZAWA SHIGETOSHI (JP)
Application Number:
PCT/JP2021/036797
Publication Date:
April 14, 2022
Filing Date:
October 05, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F20/20; B29C64/165; B29C64/264; B33Y70/10; B33Y80/00; C08F2/44; C08F2/50; C08K3/013
Foreign References:
KR20190044315A | 2019-04-30 | |||
JP2020147623A | 2020-09-17 | |||
JP2018509321A | 2018-04-05 | |||
JP2009084388A | 2009-04-23 | |||
JP2007237683A | 2007-09-20 | |||
JP2016505525W |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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