Title:
RESIN COMPOSITION FOR TEMPORARY FIXATION, RESIN FILM FOR TEMPORARY FIXATION, RESIN FILM SHEET FOR TEMPORARY FIXATION, AND METHOD FOR WORKING SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2016/035821
Kind Code:
A1
Abstract:
A resin composition for temporary fixation for forming a temporary fixation material used in a method for working a semiconductor wafer, wherein: the resin composition contains (A) a thermoplastic resin, (B) a thermosetting resin, (C) a (meth)acrylic monomer, and (D) a compound from which a base and a radical are generated by radiation, the contained amount of component (D) being at least 5 parts by mass relative to 100 parts by mass of component (C); and the method for working a semiconductor wafer includes a temporary fixation step for temporarily fixing the semiconductor wafer to a support body with the temporary fixation material interposed therebetween, a working step for working the semiconductor wafer temporarily fixed to the support body, and a separation step for separating the worked semiconductor wafer from the support body and the temporary fixation material, the temporary fixation material being irradiated with radiation in the temporary fixation step.
Inventors:
UENO KEIKO (JP)
TOKUYASU TAKAHIRO (JP)
MAKINO TATSUYA (JP)
SOBUE SHOGO (JP)
TOKUYASU TAKAHIRO (JP)
MAKINO TATSUYA (JP)
SOBUE SHOGO (JP)
Application Number:
PCT/JP2015/074966
Publication Date:
March 10, 2016
Filing Date:
September 02, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/02; C08G59/32; C08G59/50; C09J4/02; C09J7/10; C09J11/06; C09J133/04; C09J163/00; C09J183/04; C09J201/00; H01L21/304; H01L21/683
Foreign References:
| JP5458538B2 | 2014-04-02 | |||
| JP2010506406A | 2010-02-25 | |||
| JP5348360B1 | 2013-11-20 | |||
| JP5176076B2 | 2013-04-03 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
Download PDF: