RESIN COMPOSITION, TEMPORARY FIXING MATERIAL, AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

Title:

RESIN COMPOSITION, TEMPORARY FIXING MATERIAL, AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2024/063112

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a resin composition which can suppress the occurrence of voids and floating during heat treatment and can be easily peeled after the heat treatment. Moreover, another purpose of the present invention is to provide: a temporary fixing material containing said resin composition; and a manufacturing method for an electronic component using said temporary fixing material. The present invention is a resin composition containing: a resin having an imide skeleton in a repeating unit of the main chain thereof; and a (meth)acrylic copolymer.

Inventors:

NISHIUMI YUKI (JP)
TAKAHASHI TOSHIO (JP)
SHICHIRI TOKUSHIGE (JP)
HAYASHI SATOSHI (JP)
OKAYAMA HISATOSHI (JP)
DAIDO IZUMI (JP)
MORI CHIEKO (JP)

Application Number:

PCT/JP2023/034182

Publication Date:

March 28, 2024

Filing Date:

September 21, 2023

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SEKISUI CHEMICAL CO LTD (JP)

International Classes:

C08L79/08; C08F2/44; C08F20/00; C08F290/06; C08F291/12; C08G73/10; C08K5/3415; C08L33/00; C09J7/38; C09J133/00; C09J179/08; H01L21/301; H01L21/683

Domestic Patent References:

WO2021225163A1	2021-11-11
WO2012002134A1	2012-01-05
WO2017090681A1	2017-06-01

Foreign References:

JP2022109923A	2022-07-28
JP2019001967A	2019-01-10