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Patent Searching and Data


Title:
RESIN COMPOSITION FOR THREE-DIMENSIONAL PHOTOSHAPING
Document Type and Number:
WIPO Patent Application WO/2022/163358
Kind Code:
A1
Abstract:
Provided is a resin composition which is water-soluble and nevertheless can produce highly heat-resistant, three-dimensional photoshaped object. This resin composition for three-dimensional photoshaping comprises a reactive monomer, a water-soluble polymer, and a photopolymerization initiator, and gives a cured object having a tanδ main-peak temperature of 80°C or higher and gives a 1-mm-thick cured object which, after having been immersed in room-temperature water for five hours, has a residual thickness of 0.7 mm or less.

Inventors:
WATANABE, Koji (JP)
TOKAI, Tatsuya (JP)
Application Number:
PCT/JP2022/000824
Publication Date:
August 04, 2022
Filing Date:
January 13, 2022
Export Citation:
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Assignee:
NAGASE CHEMTEX CORPORATION (JP)
International Classes:
C08F2/44; B29C64/106; B29C64/35; B29C64/379; B33Y10/00; B33Y70/00; B33Y80/00; C08F2/50
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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