Title:
RESIN COMPOSITION FOR THREE-DIMENSIONAL PHOTOSHAPING
Document Type and Number:
WIPO Patent Application WO/2022/163358
Kind Code:
A1
Abstract:
Provided is a resin composition which is water-soluble and nevertheless can produce highly heat-resistant, three-dimensional photoshaped object. This resin composition for three-dimensional photoshaping comprises a reactive monomer, a water-soluble polymer, and a photopolymerization initiator, and gives a cured object having a tanδ main-peak temperature of 80°C or higher and gives a 1-mm-thick cured object which, after having been immersed in room-temperature water for five hours, has a residual thickness of 0.7 mm or less.
Inventors:
WATANABE KOJI (JP)
TOKAI TATSUYA (JP)
TOKAI TATSUYA (JP)
Application Number:
PCT/JP2022/000824
Publication Date:
August 04, 2022
Filing Date:
January 13, 2022
Export Citation:
Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C08F2/44; B29C64/106; B29C64/35; B29C64/379; B33Y10/00; B33Y70/00; B33Y80/00; C08F2/50
Domestic Patent References:
| WO2018168867A1 | 2018-09-20 | |||
| WO2020017615A1 | 2020-01-23 |
Foreign References:
| JP2020012052A | 2020-01-23 | |||
| JPH04123834A | 1992-04-23 | |||
| JP2012111226A | 2012-06-14 | |||
| JP2018058974A | 2018-04-12 | |||
| JP2020526413A | 2020-08-31 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
Download PDF:
Previous Patent: FILM FORMATION METHOD AND FILM FORMATION APPARATUS
Next Patent: SEALANT COMPOSITION AND TIRE USING SAME
Next Patent: SEALANT COMPOSITION AND TIRE USING SAME