Title:
RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/196718
Kind Code:
A1
Abstract:
The present invention provides a material that has a low dielectric loss tangent and is suitable for use as an insulating material for a printed wiring board or the like, a resin composition used to produce the material, and applications in which the material is used. The present invention pertains to a resin composition including a mono(C6-C20 alkyl)diallyl isocyanurate and a polyphenylene ether resin, a cured product of the resin composition, and an application of the cured product.
Inventors:
OTSUKA AKIHITO (JP)
KASHIWABARA TAKASHI (JP)
AOKI KAZUNORI (JP)
KUMANO TAKESHI (JP)
KASHIWABARA TAKASHI (JP)
AOKI KAZUNORI (JP)
KUMANO TAKESHI (JP)
Application Number:
PCT/JP2020/013568
Publication Date:
October 01, 2020
Filing Date:
March 26, 2020
Export Citation:
Assignee:
SHIKOKU CHEM (JP)
International Classes:
C08L71/12; B32B15/08; B32B27/28; C08J5/24; C08K5/3492; H05K1/03
Foreign References:
| JP2004196958A | 2004-07-15 | |||
| JP2009299041A | 2009-12-24 | |||
| JP2008050467A | 2008-03-06 | |||
| JP2013159624A | 2013-08-19 | |||
| JP2003160726A | 2003-06-06 | |||
| JP2016139798A | 2016-08-04 | |||
| JP2017079293A | 2017-04-27 | |||
| JP2017511404A | 2017-04-20 | |||
| JP2015151413A | 2015-08-24 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
Download PDF: