Title:
RESIN COMPOSITION, VARNISH, LAMINATED PLATE, PRINTED WIRING BOARD, AND MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/276379
Kind Code:
A1
Abstract:
Provided is a resin composition obtained by melting a resin mixture containing a bismaleimide compound (A), the composition forming a cured object to be used in electronic and electrical components as a laminated plate, printed wiring board, adhesive, sealant, coating material, molded product, or the like having high heat resistance and low dielectric properties (a low dielectric constant and low dielectric tangent). The bismaleimide compound (A) comprises an aliphatic bismaleimide compound represented by formula (1) and an aromatic bismaleimide compound represented by formula (2). (In formula (1), R1 is a C6-12 alkylene group.) (In formula (2), R2 is a C6-30 hydrocarbon group having an aromatic ring, each X1 is independently an oxygen atom or a single bond, R3 and R4 are C1-6 hydrocarbon groups, and a and b are each an integer of 0-3.)
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Inventors:
KAWASAKI TATSUYA (JP)
NAKAZAWA YUKA (JP)
KATOU TSUYOSHI (JP)
MATSUDA JUNA (JP)
NAKAZAWA YUKA (JP)
KATOU TSUYOSHI (JP)
MATSUDA JUNA (JP)
Application Number:
PCT/JP2022/015425
Publication Date:
January 05, 2023
Filing Date:
March 29, 2022
Export Citation:
Assignee:
PRINTEC CORP (JP)
International Classes:
C08K5/17; B32B15/08; C08K5/3415; C08L45/02; H05K1/03
Domestic Patent References:
| WO2019240092A1 | 2019-12-19 | |||
| WO2020161926A1 | 2020-08-13 | |||
| WO2019188189A1 | 2019-10-03 |
Foreign References:
| CN107227015A | 2017-10-03 | |||
| JP2019157027A | 2019-09-19 | |||
| JP2014105317A | 2014-06-09 | |||
| JP2019157097A | 2019-09-19 | |||
| JP2016204639A | 2016-12-08 | |||
| JP2016196548A | 2016-11-24 | |||
| CN112778701A | 2021-05-11 | |||
| JP2017115164A | 2017-06-29 |
Attorney, Agent or Firm:
OKUBO, Katsuyuki (JP)
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