Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/040282
Kind Code:
A1
Abstract:
Disclosed is a resin composition or the like containing a thermoplastic resin and a polymer having a structural unit represented by the general formula (I) below in a molecule. (I) (In the formula, n represents an integer of 2-1000; R1 represents a substituted or unsubstituted lower alkyl, a substituted or unsubstituted cycloalkyl, a substituted or unsubstituted aryl or a substituted or unsubstituted aralkyl; R2, R3, R4 and R5 may be the same or different and respectively represent a hydrogen atom, a substituted or unsubstituted lower alkyl, a substituted or unsubstituted cycloalkyl, a substituted or unsubstituted aryl or a substituted or unsubstituted aralkyl. In this connection, two or more R1, R2, R3 and R4 may be the same or different from each other respectively.)
Inventors:
KODAMA SAI
INAYAMA TOSHIHIRO
MURATA SHIGERU
INAYAMA TOSHIHIRO
MURATA SHIGERU
Application Number:
PCT/JP2004/016350
Publication Date:
May 06, 2005
Filing Date:
October 28, 2004
Export Citation:
Assignee:
KYOWA HAKKO CHEMICAL CO LTD (JP)
KODAMA SAI
INAYAMA TOSHIHIRO
MURATA SHIGERU
KODAMA SAI
INAYAMA TOSHIHIRO
MURATA SHIGERU
International Classes:
C08G18/66; C08L67/04; C08L67/00; C08L75/04; (IPC1-7): C08L101/00; C08F16/12; C08G18/00; C08G63/00; C08G65/00
Foreign References:
JP2003292768A | 2003-10-15 | |||
JPH11147924A | 1999-06-02 | |||
JPH08217820A | 1996-08-27 | |||
JPH06239944A | 1994-08-30 |
Attorney, Agent or Firm:
Iwahashi, Kazuyuki (Intellectual Property Department, 6-1,
Ohtemachi 1-chom, Chiyoda-ku Tokyo 85, JP)
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