Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2009/060986
Kind Code:
A1
Abstract:
Disclosed is a resin composition containing a halogen-free flame retardant
having excellent flame retardancy and heat resistance. Specifically disclosed
is a resin composition containing 100 parts by weight of an aromatic polycarbonate
resin (component A), 0.001-8 parts by weight of a flame retardant (component
B) and 0.01-6 parts by weight of a fluorine-containing drip inhibitor (component
C). This resin composition is characterized in that the flame retardant (component
B) is composed of a flame retardant which is obtained by introducing 0.1-2.5%
by weight of a sulfonic acid group and/or a sulfonate group, as a sulfur content,
into an aromatic polymer. Also specifically disclosed are a method for producing
such a resin composition and a molded article of such a resin composition.
Inventors:
TOMODA TAKUYA (JP)
INAGAKI YASUHITO (JP)
INAGAKI YASUHITO (JP)
Application Number:
PCT/JP2008/070621
Publication Date:
May 14, 2009
Filing Date:
November 06, 2008
Export Citation:
Assignee:
TEIJIN CHEMICALS LTD (JP)
SONY CORP (JP)
TOMODA TAKUYA (JP)
INAGAKI YASUHITO (JP)
SONY CORP (JP)
TOMODA TAKUYA (JP)
INAGAKI YASUHITO (JP)
International Classes:
C08L69/00; B09B3/00; C08K7/00; C08L25/04; C08L27/12; C08L101/02
Foreign References:
| JP2008231324A | 2008-10-02 | |||
| JP2003064229A | 2003-03-05 | |||
| JP2002212409A | 2002-07-31 | |||
| JP2001181342A | 2001-07-03 |
Attorney, Agent or Firm:
OHSHIMA, Masataka (BN Gyoen Building17-11, Shinjuku 1-chom, Shinjuku-ku Tokyo 22, JP)
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