Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/005471
Kind Code:
A1
Abstract:
Provided is a light- and heat-curable resin composition that has a sufficiently long pot life. The resin composition contains (A) an acrylic resin, (B) a thiol compound, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization suppressor. The resin composition preferably further contains (F) a radical polymerization initiator. The resin composition preferably also contains (G) a compound other than an acrylic resin having at least two double bonds.

Inventors:
IWAYA KAZUKI
Application Number:
PCT/JP2012/061386
Publication Date:
January 10, 2013
Filing Date:
April 27, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NAMICS CORP (JP)
IWAYA KAZUKI
International Classes:
C08G75/04; C08G59/02; C08G75/045; C08K5/55; C08L9/00; C08L81/02; C09J11/06; C09J109/00; C09J133/00; C09J147/00; C09J181/00; C09K3/10; H01L23/29; H01L23/31
Domestic Patent References:
WO2010071171A12010-06-24
WO2005052021A12005-06-09
WO2009069562A12009-06-04
Foreign References:
JP2009051954A2009-03-12
JP2008001867A2008-01-10
JP2010084096A2010-04-15
JP2000230112A2000-08-22
JPH11256013A1999-09-21
JP2011026492A2011-02-10
JP2012017448A2012-01-26
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Patent business corporation Tsukuni (JP)
Download PDF:
Claims: