Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/005471
Kind Code:
A1
Abstract:
Provided is a light- and heat-curable resin composition that has a sufficiently long pot life. The resin composition contains (A) an acrylic resin, (B) a thiol compound, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization suppressor. The resin composition preferably further contains (F) a radical polymerization initiator. The resin composition preferably also contains (G) a compound other than an acrylic resin having at least two double bonds.
Inventors:
IWAYA KAZUKI
Application Number:
PCT/JP2012/061386
Publication Date:
January 10, 2013
Filing Date:
April 27, 2012
Export Citation:
Assignee:
NAMICS CORP (JP)
IWAYA KAZUKI
IWAYA KAZUKI
International Classes:
C08G75/04; C08G59/02; C08G75/045; C08K5/55; C08L9/00; C08L81/02; C09J11/06; C09J109/00; C09J133/00; C09J147/00; C09J181/00; C09K3/10; H01L23/29; H01L23/31
Domestic Patent References:
WO2010071171A1 | 2010-06-24 | |||
WO2005052021A1 | 2005-06-09 | |||
WO2009069562A1 | 2009-06-04 |
Foreign References:
JP2009051954A | 2009-03-12 | |||
JP2008001867A | 2008-01-10 | |||
JP2010084096A | 2010-04-15 | |||
JP2000230112A | 2000-08-22 | |||
JPH11256013A | 1999-09-21 | |||
JP2011026492A | 2011-02-10 | |||
JP2012017448A | 2012-01-26 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Patent business corporation Tsukuni (JP)
Patent business corporation Tsukuni (JP)
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Claims: