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Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/169880
Kind Code:
A1
Abstract:
A resin composition for insulating coating materials, which contains a polyimide resin and/or a precursor thereof and a polymer having a heterocyclic ring in a side chain, and which contains 0.1-7 parts by weight of the polymer having a heterocyclic ring in a side chain per 100 parts by weight of the polyimide resin and/or a precursor thereof. By adding a predetermined amount of a polymer that has a heterocyclic ring in a side chain, a resin composition for insulating coating materials is able to achieve excellent bending resistance, while maintaining excellent heat resistance.

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Inventors:
KATO TAKESHI (JP)
ISHIKUBO AKIRA (JP)
ECHIGO YU (JP)
MATSUMOTO MIKA (JP)
SUGIYAMA JIRO (JP)
Application Number:
PCT/JP2017/010853
Publication Date:
October 05, 2017
Filing Date:
March 17, 2017
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G73/10; H01B3/30; C08L79/08
Domestic Patent References:
WO2005068556A12005-07-28
Foreign References:
JPS5360953A1978-05-31
JP2015165015A2015-09-17
JP2015130281A2015-07-16
JPH04288377A1992-10-13
JP2011029100A2011-02-10
JP2009091500A2009-04-30
JP2015072899A2015-04-16
Other References:
See also references of EP 3438992A4
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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