Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/173920
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition which enables the achievement of a cured film that has a low dielectric loss tangent and is capable of withstanding a heat treatment and a chemical treatment, said treatments being associated with the formation of a coil pattern. In order to achieve the above-described purpose, the configuration of the present invention is as follows. A resin composition which contains (P) a resin that has an alicyclic structure and an aromatic ring structure, and wherein the resin (P) that has an alicyclic structure and an aromatic ring structure has a group having two or more alicyclic rings and a group wherein two or more benzene rings are bonded by means of a single bond.
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Inventors:
KIUCHI YOHEI (JP)
OKUDA RYOJI (JP)
OKUDA RYOJI (JP)
Application Number:
PCT/JP2018/010245
Publication Date:
September 27, 2018
Filing Date:
March 15, 2018
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L101/00; C08G73/10; C08L79/08; H01B3/30; H01B17/56
Foreign References:
| JP2005320393A | 2005-11-17 | |||
| JPH01132632A | 1989-05-25 | |||
| JPH0241319A | 1990-02-09 | |||
| JP2015134842A | 2015-07-27 | |||
| JP2018053156A | 2018-04-05 |
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