Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/088102
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition which can be cured in a relatively short time (within several hours) at a low temperature of about room temperature and is suitable as a one-liquid type adhesive for use in manufacturing image sensor modules or electronic components, wherein contamination of the surroundings due to volatilization of a resin hardly occurs. This resin composition contains a 2-methylene 1,3-dicarbonyl compound and an initiator. The 2-methylene 1,3-dicarbonyl compound has a molecular weight of 180-10000, and the initiator includes a basic substance having a pKa of at least 8. In addition, the 2-methylene 1,3-dicarbonyl compound contains a structural unit represented by formula (I).
Inventors:
ARAI FUMINORI (JP)
IWAYA KAZUKI (JP)
IWAYA KAZUKI (JP)
Application Number:
PCT/JP2018/040337
Publication Date:
May 09, 2019
Filing Date:
October 30, 2018
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08F22/10; C08F4/00; C09J4/00; C09J11/06
Domestic Patent References:
| WO2012054616A2 | 2012-04-26 | |||
| WO2012054633A2 | 2012-04-26 | |||
| WO2016040261A1 | 2016-03-17 |
Foreign References:
| JP2017527667A | 2017-09-21 | |||
| JP2017527668A | 2017-09-21 | |||
| JP2015512460A | 2015-04-27 | |||
| JP2017526791A | 2017-09-14 | |||
| JP2004504730A | 2004-02-12 | |||
| JP2017036361A | 2017-02-16 | |||
| JP2016506072A | 2016-02-25 | |||
| JP2015518503A | 2015-07-02 | |||
| JP2010117545A | 2010-05-27 | |||
| JP2008184514A | 2008-08-14 |
Other References:
See also references of EP 3705501A4
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Download PDF: