Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/129776
Kind Code:
A1
Abstract:
The present invention provides a resin composition which contains an epoxy resin and a curing agent for the epoxy resin, and which is configured such that: epoxy compounds respectively represented by general formula (1) and general formula (2) are contained as the epoxy resin; and a phenolic compound represented by general formula (3) is contained as the curing agent.
In general formula (1) and general formula (2), each of R1 and R2 represents a methyl group, an ethyl group, a linear or branched propyl group or an n-, i- or t-butyl group.
In general formula (3), R3 represents H, CH3 or C2H5.
Inventors:
TABUCHI AKIHIRO (JP)
Application Number:
PCT/JP2019/048511
Publication Date:
June 25, 2020
Filing Date:
December 11, 2019
Export Citation:
Assignee:
NITTO SHINKO CORP (JP)
International Classes:
C08G59/24; C08G59/62; C08K3/38; C08K9/06; C08L63/00
Domestic Patent References:
| WO2018181737A1 | 2018-10-04 |
Foreign References:
| JP2009173728A | 2009-08-06 | |||
| JP2012046616A | 2012-03-08 | |||
| JP2001026633A | 2001-01-30 | |||
| JP2015059186A | 2015-03-30 | |||
| JP2013234313A | 2013-11-21 | |||
| JP2010094887A | 2010-04-30 |
Other References:
See also references of EP 3901191A4
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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