Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/102757
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition such that the minimum melt viscosity can be further reduced, the relative dielectric constant (Dk) and the dielectric loss factor (Df) are low, the glass transition temperature is high, and a cured article having a superior copper plating peel strength can be obtained, and provides a resin composition containing (A) a maleimide compound that has a isopropylidene group bonded to two aromatic carbon atoms in different aromatic rings, (B) an active ester compound, and (C) an epoxy resin.
Inventors:
KAWAI KENJI (JP)
Application Number:
PCT/JP2021/041792
Publication Date:
May 19, 2022
Filing Date:
November 12, 2021
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
B32B27/34; C08K5/10; C08K5/3415; C08L63/00; H01L23/14; H05K1/03
Domestic Patent References:
| WO2020054526A1 | 2020-03-19 |
Foreign References:
| JP2019044128A | 2019-03-22 | |||
| JP2013234328A | 2013-11-21 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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