Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/186219
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition capable of giving cured objects which can have a lower dielectric dissipation factor, can be inhibited from having cracks after desmearing, and have an excellent strength of peeling from copper platings. This resin composition comprises (A) epoxy resins and (B) an active ester compound, wherein the component (A) comprises (A-1) an epoxy resin represented by formula (1) and having an epoxy equivalent of 1,000-5,000 g/eq. and (A-2) an epoxy resin having an epoxy equivalent of 200 g/eq. or less. The symbols in formula (1) are as defined in the specification.
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Inventors:
KAWAI KENJI (JP)
Application Number:
PCT/JP2022/008661
Publication Date:
September 09, 2022
Filing Date:
March 01, 2022
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
C08G59/24; C08K3/36; C08L51/04; C08L63/00; H05K1/03
Foreign References:
| JP2016089165A | 2016-05-23 | |||
| JP2014034580A | 2014-02-24 | |||
| JP2020132646A | 2020-08-31 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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