Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/008381
Kind Code:
A1
Abstract:
This resin composition contains an olefin-based polymer A, a polymer B-1 and a polymer B-2. The polymer B-1 is a poly(3-hydroxyalkanoate)-based polymer having a melting point of 150-220ºC. The polymer B-2 is an aromatic polyester having a melting point of 180-220ºC. Relative to a total of 100 parts by mass of the olefin-based polymer A, the polymer B-1, and the polymer B-2, the content of the olefin-based polymer A is 70-95 parts by mass, the content of the polymer B-1 is 1-15 parts by mass, and the content of the polymer B-2 is 1-25 parts by mass.
Inventors:
CHIBA SHUNSUKE (JP)
SANJO HARUHIKO (JP)
NAKAJIMA HIDEAKI (JP)
SANJO HARUHIKO (JP)
NAKAJIMA HIDEAKI (JP)
Application Number:
PCT/JP2022/028648
Publication Date:
February 02, 2023
Filing Date:
July 25, 2022
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
NEWLIGHT TECH INC (US)
NEWLIGHT TECH INC (US)
International Classes:
C08L23/00; C08L23/12; C08L67/02; C08L67/04; C08L101/16
Foreign References:
| CN102146598A | 2011-08-10 | |||
| CN105419047A | 2016-03-23 | |||
| JP2012036361A | 2012-02-23 | |||
| JP2003096668A | 2003-04-03 | |||
| JP2010031237A | 2010-02-12 | |||
| JP2008261070A | 2008-10-30 |
Other References:
A. ZAMBELLI ET AL., MACROMOLECULES, vol. 6, 1973
J. BACTERIOL., 1997, pages 1794821
J. BACTERIOL., 1997, pages 1794821
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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