Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/013495
Kind Code:
A1
Abstract:
A resin composition having low warpage and excellent heat resistance, characterized by: containing, based on 100 total mass parts of (A)-(C), 25-48 mass parts of a polyphenylene sulfide resin (A) having an MVR measured at 295°C under 1.00 kgf load of 60-500 cm3/10 min, an amorphous rubber-reinforced polystyrene or a polystyrene (B) having an MVR measured at 200°C under 5 kgf load of 0.3-16 cm3/10 min and/or a polyphenylene ether resin (C); the total content of (B) and (C) being 52-75 mass parts; and also containing 5-150 mass parts of a fibrous filler (D).
Inventors:
MUTO FUMIHIRO (JP)
ISEKI SHUTA (JP)
ISEKI SHUTA (JP)
Application Number:
PCT/JP2022/028938
Publication Date:
February 09, 2023
Filing Date:
July 27, 2022
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
C08L81/02; C08G59/00; C08J5/04; C08K7/02; C08L25/06; C08L25/10; C08L63/00; C08L71/12; H01R13/46
Foreign References:
| JP2004168886A | 2004-06-17 | |||
| JP2004269664A | 2004-09-30 | |||
| JPS50156561A | 1975-12-17 | |||
| JP2004083867A | 2004-03-18 | |||
| JP2010195399A | 2010-09-09 | |||
| JP2020180192A | 2020-11-05 | |||
| JP2014141567A | 2014-08-07 | |||
| JP2002249661A | 2002-09-06 |
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
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