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Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/027013
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition capable of giving cured objects excellent in terms of mechanical strength and plating-film adhesion thereto. This resin composition includes (A) a compound containing a radical-polymerizable group having a carbodiimide structure, and further includes (B) a compound containing a radical-polymerizable group having no carbodiimide structure and/or (C) a heat-curable resin.

Inventors:
FUJISHIMA SHOHEI (JP)
IKEHIRA SHU (JP)
Application Number:
PCT/JP2022/031539
Publication Date:
March 02, 2023
Filing Date:
August 22, 2022
Export Citation:
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Assignee:
AJINOMOTO KK (JP)
International Classes:
C08F220/36; B32B27/38; B32B27/42; C08F2/44; C08F216/12; H05K1/03
Foreign References:
JPH09309871A1997-12-02
JP2019156909A2019-09-19
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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