Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN AND RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/004899
Kind Code:
A1
Abstract:
Provided is a resin that, when included in a resin composition, makes it possible to form a coating film of the resin composition that has adhesion and blocking resistance on the coated surface thereof. The resin includes a polymer containing monomer A below as a structural unit, wherein the monomer A represents at least 50% of the total amount of the polymer. Monomer A: a monomer having an alicyclic structure and/or a heterocyclic structure as ring structure, for which the SP value of a side chain moiety that is an SP value calculated for a chemical structure moiety defined as R2 of formula (1), is 8.5 or more and 13.0 or less, wherein the molar volume of the side chain moiety calculated for the chemical structure moiety defined as R2 of formula (1) is 170 or less. Formula (1): CH2=C(R1)R2 (in said formula, R1 is hydrogen or a methyl group).

More Like This:
Inventors:
KOTAKI TOMOHIRO (JP)
INAMI YURI (JP)
ARAI TOMOYUKI (JP)
IIJIMA KYOICHI (JP)
Application Number:
PCT/JP2023/023462
Publication Date:
January 04, 2024
Filing Date:
June 26, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DNP FINE CHEMICALS CO LTD (JP)
International Classes:
C08F20/10; C08F10/14; C08L33/04; C09D11/30
Foreign References:
JP2022085427A2022-06-08
JP2013018951A2013-01-31
JP2005272790A2005-10-06
JP2013223958A2013-10-31
JP2019142057A2019-08-29
JP2018141101A2018-09-13
JP2023066997A2023-05-16
JP2009263622A2009-11-12
JP2015024508A2015-02-05
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
Download PDF: