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Patent Searching and Data


Title:
RESIN DISPERSION OF MODIFIED NANO-SILICA PARTICLES AND PREPARATION METHOD FOR AND APPLICATION OF RESIN DISPERSION
Document Type and Number:
WIPO Patent Application WO/2023/208006
Kind Code:
A1
Abstract:
Embodiments of the present application provide a resin dispersion of modified nano-silica particles and a preparation method for and application of the resin dispersion. The resin dispersion contains modified nano-silica particles having a mass ratio of 39-60 wt%, a dispersion resin, and a dispersion assistant agent; the surface of the modified nano-silica particles is modified with an organosilicon compound; and the ratio of the average particle size of the modified nano-silica particles measured by means of a dynamic light scattering method to the average primary particle size thereof is less than or equal to 2.0. The modified nano-silica particles are good in monodispersity and high in mass ratio in the resin dispersion, and when the resin dispersion is used in a packaging resin material, the modified nano-silica particles can be uniformly dispersed in the material, such that the fluidity of the packaging material would not be significantly reduced, and the thermal expansion coefficient of the packaging material can be effectively reduced. The embodiments of the present application further provide a modified silica sol and a preparation method therefor.

Inventors:
YUAN CAN (CN)
LIU CHENGJIE (CN)
SHENG LVHONG (CN)
XIE XIAOLIN (CN)
BAO XUSHENG (CN)
ZHOU XINGPING (CN)
Application Number:
PCT/CN2023/090707
Publication Date:
November 02, 2023
Filing Date:
April 25, 2023
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
C08K3/36; C08L63/00
Foreign References:
JP2013126925A2013-06-27
JP2012214642A2012-11-08
JP2014209621A2014-11-06
JP2013028481A2013-02-07
KR20150050953A2015-05-11
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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