Title:
RESIN FILM FORMING FILM AND RESIN FILM FORMING COMPOSITE SHEET
Document Type and Number:
WIPO Patent Application WO/2019/008898
Kind Code:
A1
Abstract:
This resin film forming film satisfies the following conditions (i) and (ii): (i) when a first test specimen manufactured using a first laminated body which comprises a plurality of the resin film forming films laminated together and has a size of 50 mm × 50 mm and a thickness of 200 μm is immersed in pure water for two hours, the first test specimen has a water absorption of 0.55% or less; and (ii) when a second test specimen manufactured using a second laminated body in which the resin film forming film is attached to a silicon mirror wafer has been left in an environment of 23°C and 50% RH for 30 minutes, and when the second test specimen after the elapse of the time has been immersed in pure water for two hours, an adhesive force between the resin film forming films or a cured product thereof and the silicon mirror wafer measured before and after the immersion exhibits an adhesive force change rate of 60% or less.
Inventors:
FUSE KEISHI (JP)
Application Number:
PCT/JP2018/018248
Publication Date:
January 10, 2019
Filing Date:
May 11, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; H01L21/301
Domestic Patent References:
| WO2015046529A1 | 2015-04-02 |
Foreign References:
| JP2011501233A | 2011-01-06 | |||
| JP2005317758A | 2005-11-10 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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