Title:
RESIN FILM, HIGH-FREQUENCY CIRCUIT BOARD, AND PRODUCTION METHOD FOR HIGH-FREQUENCY CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/213527
Kind Code:
A1
Abstract:
Provided are: a resin film that can achieve improved thermal dimensional stability without a reduction in the low-dielectric properties and heat resistance characteristic of a film that is for use, for example, in a high-frequency circuit board produced from a poly(arylene ether ketone) resin; a high-frequency circuit board; and a production method for the high-frequency circuit board. A resin film 1 that contains 100 parts by mass of a poly(arylene ether ketone) resin and 10–80 parts by mass of a non-swelling synthetic mica. The resin film 1 is molded using a molding material 4 that contains a non-swelling synthetic mica and can therefore achieve a reduced coefficient of linear expansion. As a result, the thermal dimensional stability of the resin film 1 is improved, it is possible to suppress differences in thermal dimensional properties relative to a metal layer that comprises a metal foil 2 or the like, and, when a conductive layer 3 is formed to produce a high-frequency circuit board, it is possible to prevent curling and deformation of the high-frequency circuit board.
Inventors:
GONDA TAKASHI (JP)
KOIZUMI AKIHIRO (JP)
KOIZUMI AKIHIRO (JP)
Application Number:
PCT/JP2020/016123
Publication Date:
October 22, 2020
Filing Date:
April 10, 2020
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
B32B27/00; B32B7/027; B32B15/08; B32B27/20; C08J5/18; C08K3/34; C08L71/10; H05K1/03; H05K3/46
Foreign References:
| JP2002338823A | 2002-11-27 | |||
| JP2019046980A | 2019-03-22 | |||
| JP2018109090A | 2018-07-12 |
Attorney, Agent or Firm:
FUJIMOTO Eisuke et al. (JP)
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