Title:
RESIN FILM AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/001751
Kind Code:
A1
Abstract:
Provided are a resin film wherein film deformation is further suppressed, and a resin film forming method. The resin film is a long resin film (11) that has an embossed section (13A) at least on the both side end sections along the longitudinal direction. The cross-section of the embossed section (13A) in a direction orthogonally intersecting with the longitudinal direction has a pair of protruding sections (13b, 13b) and a recessed section that is provided between the pair of protruding sections (13b, 13b) on the surface (14b) of the resin film (11) on the opposite side from the surface (14a) whereupon the pair of protruding sections (13a, 13b) are formed.
Inventors:
MORITA TAKAAKI (JP)
Application Number:
PCT/JP2009/061300
Publication Date:
January 07, 2010
Filing Date:
June 22, 2009
Export Citation:
Assignee:
KONICA MINOLTA OPTO INC (JP)
MORITA TAKAAKI (JP)
MORITA TAKAAKI (JP)
International Classes:
B29C59/00; B29C59/16; B29L7/00; B29L11/00
Domestic Patent References:
| WO2007063653A1 | 2007-06-07 |
Foreign References:
| JP3134651U | 2007-08-23 | |||
| JPS6369624A | 1988-03-29 | |||
| JP2007119181A | 2007-05-17 | |||
| JPH0691753A | 1994-04-05 | |||
| JP2009040964A | 2009-02-26 |
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